Copper SMT heat sink optimal for heat dissipation measures of small power semiconductors.
The FK 250 06 LF PAK is a surface mount (SMT/SMD) heat sink compatible with various power semiconductor packages, including LF PAK (SOT-669).
It uses high thermal conductivity copper (Cu) to efficiently dissipate heat from surface mount devices that generate heat, such as MOSFETs and power ICs. With a compact design of 8×15×6.5mm, it is suitable for heat dissipation measures in high-density mounting boards and limited spaces.
The solderable surface specification allows for direct soldering to the board and is compatible with reflow mounting processes. It can be used as a thermal management component in electronic devices that require reliability, such as industrial equipment, power circuits, and communication devices.
As a surface mount heat sink manufactured by Fischer Elektronik, it contributes to temperature rise suppression of small power semiconductors and extends the lifespan of electronic devices.